Related skills
aerospace production management microelectronics gd&t die bondπ Description
- Lead hourly workforce; assess performance; provide feedback; corrective actions.
- Set example; take feedback; motivate for safety, quality, rate.
- Mentor team; assist with design decisions and project strategies.
- Establish area metrics to drive training, flow, efficiency, defect reduction.
- Drive NPI of new hardware with technician resources.
- Hands-on assembly and testing; troubleshoot as needed.
π― Requirements
- High school diploma or equivalent.
- 3+ years in production/manufacturing.
- 1+ years leading a team or project.
- Bachelor's or associate's degree (preferred).
- Experience in microelectronics assembly (die bond, wire bond).
- Aerospace manufacturing experience; fault finding.
π Benefits
- Medical, vision, dental coverage.
- 401(k) retirement plan.
- Paid vacation and holidays.
- Disability and life insurance.
- Stock options and bonuses.
- Shuttle service Seattle to Redmond.
Meet JobCopilot: Your Personal AI Job Hunter
Automatically Apply to Engineering Jobs. Just set your
preferences and Job Copilot will do the rest β finding, filtering, and applying while you focus on what matters.
Help us maintain the quality of jobs posted on Empllo!
Is this position not a remote job?
Let us know!