Related skills
sip mcm bga fccsp wlcsp📋 Description
- Own packaging assembly processes from concept to mass production for wafer-level and chip-level systems
- Develop packaging technologies and baselines for assembly lines
- Bring-up for NPI and NTI for packaging lines
- Own packaging prototypes, product development and release to production
- Select equipment and materials to meet quality, reliability, cost, and yield targets
- Interface with suppliers for continuous improvement and cost reduction
🎯 Requirements
- Bachelor's degree in electrical, mechanical, chemical engineering, materials science, or physics
- 5+ years of professional experience in semiconductor assembly and packaging
- Advanced technical degree
- 7+ years industry experience with microelectronics packaging development
- Packaging familiarity with flip-chip, BGA, fcCSP, WLCSP, SiP, MCM
- Hands-on packaging, PCB/PCBA, or SMT assembly experience
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