Related skills
signal integrity power integrity bga co-packaged optics (cpo) rf packaging📋 Description
- Own and drive advanced package selection and BGA config
- Package/SIP layout, optimization, verification and tapeout
- Coordinate with cross-functional teams on new product packaging
- Optimize silicon floor plan, bump and package pinout
- Simulate and optimize signal/power integrity and RF
🎯 Requirements
- Bachelor's degree in electrical engineering, computer engineering, or physics
- 5+ years of IC package design experience
- Co-packaged Optics (CPO) experience
- Substrate design for RF, digital, high-speed, mixed-signal die
- Cadence APD+/SIP or similar design tools experience
- SI/PI fundamentals and EM tool proficiency (SIWave, HFSS, ADS)
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