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ads hfss siwave co-packaged optics (cpo) bga packaging📋 Description
- Own and drive advanced package selection, BGA configuration and package structure
- Responsible for package/SIP layout, optimization, design verification and tapeout
- Interface with cross-functional groups on new product package decisions
- Work cross-functionally to optimize silicon floor plan, bump and package pinout
- Simulate and optimize signal/power integrity and RF performance of the package
- Drive methodology, innovations, and productivity improvements in package design
🎯 Requirements
- Bachelor's degree in electrical engineering, computer engineering, or physics
- 5+ years of IC package design experience
- Co-packaged Optics (CPO) experience
- Thorough understanding of signal and power integrity fundamentals
- Substrate design experience for RF, digital, high-speed and mixed signal die
- Cadence APD+/SIP or similar design tools
🎁 Benefits
- Medical, vision, and dental coverage
- 401(k) retirement plan
- Short and long-term disability and life insurance
- Paid parental leave
- Vacation and holidays
- Stock options or Employee Stock Purchase Plan
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