Related skills
sem x-ray csam smt lapping_polishing📋 Description
- Support destructive and non-destructive analyses across hardware life-cycle
- Assist analyses of rework and recovery on non-conforming hardware
- Analyze piece part failures and non-conforming material
- Support First Article Inspection Reports
- Provide surge support for critical analyses or qualification tests
🎯 Requirements
- Bachelor's degree in materials science, electrical engineering, physics, or STEM
- 5+ years in semiconductor, package, and/or PCBA reliability
- 4+ years failure analysis on semiconductor packages/devices
- Experience with non-destructive techniques: VI, X-Ray, CT, SEM, CSAM
- Destructive analysis like cross section, lapping/polishing, dye decap
- Understanding of basic electronic theory
🎁 Benefits
- Medical, vision, dental coverage
- 401(k) retirement plan
- Disability and life insurance
- Paid parental leave and holidays
- Employee stock purchase plan
- 3 weeks vacation and paid sick leave
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