Related skills
spc die attach xrf pvd photolithographyπ Description
- Operate and maintain deposition systems (PVD) for thin films.
- Operate photolithography tools to apply resist, align, expose, and develop.
- Monitor process with in-situ sensors and metrology tools (3D profilometry, XRF).
- Perform wafer/die singulation with dicing saws, lasers, and plasma etching.
- Load/unload materials into molding systems and die attach equipment.
- Adhere to cleanroom gowning, chemical safety, and ESD guidelines.
π― Requirements
- High school diploma or equivalent.
- 3+ years in hands-on manufacturing; or BS in engineering/math/science.
- Preferred: BS in Materials Science or EE; 6+ years in semiconductor ops.
- Proficiency in photolithography, electrochemical plating, die attach.
- Experience with metrology tools: XRF, 3D profilometer, C-SAM.
- Ability to work all shifts; overtime; cleanroom attire required; dexterity.
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