Silicon Packaging Technician, Silicon Assembly (Starlink)

Added
2 days ago
Type
Full time
Salary
Salary not provided

Related skills

spc die attach xrf pvd photolithography

πŸ“‹ Description

  • Operate and maintain deposition systems (PVD) for thin films.
  • Operate photolithography tools to apply resist, align, expose, and develop.
  • Monitor process with in-situ sensors and metrology tools (3D profilometry, XRF).
  • Perform wafer/die singulation with dicing saws, lasers, and plasma etching.
  • Load/unload materials into molding systems and die attach equipment.
  • Adhere to cleanroom gowning, chemical safety, and ESD guidelines.

🎯 Requirements

  • High school diploma or equivalent.
  • 3+ years in hands-on manufacturing; or BS in engineering/math/science.
  • Preferred: BS in Materials Science or EE; 6+ years in semiconductor ops.
  • Proficiency in photolithography, electrochemical plating, die attach.
  • Experience with metrology tools: XRF, 3D profilometer, C-SAM.
  • Ability to work all shifts; overtime; cleanroom attire required; dexterity.
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