Own packaging assembly from concept to mass production (wafer-level & chip-level)
Develop new packaging tech and baselines (wafer processes, SMT, flip chip)
Lead NPI/NTI bring-up for assembly packaging lines
Own packaging prototypes, development, and release to production
Select equipment and materials to meet quality, reliability, cost, yield
Interface with suppliers for continuous improvement and cost reductions

🎯 Requirements

Bachelor's degree in engineering (EE/ME/ChE/MSE/Physics or related)
1+ years with semiconductor packaging processing equipment or packaging design (internship OK)
Advanced technical degree
3+ years industry experience with microelectronics packaging development
Hands-on packaging, PCB/PCBA or SMT assembly experience
OSAT (outsourced semiconductor assembly and test) experience

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