Own packaging assembly from concept to mass production
Develop new packaging tech and baselines
Own prototypes, release to production, and sustainment
Implement OCAP, SPC and defect-yield analysis
Cross-functional interface with silicon design, materials, thermal, and production
Deploy advanced packaging in SpaceX products

🎯 Requirements

Bachelor's degree in engineering, math, or science
1+ years in manufacturing environment or related experience
3+ years in semiconductor manufacturing processes in fab
Proficiency in data analysis and SPC tools (e.g., JMP, SQL)
Experience in NPI, FAIR, and scaling to HVM
Ability to work all shifts and travel up to 10%

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