Related skills
failure analysis doe thermal imaging npi pcbas๐ Description
- Perform failure analysis on PCBAs, components, modules from test campaigns.
- Troubleshoot failures using schematics, circuit tracing, fault isolation, and DOE as needed.
- Use microscopy, X-ray/CT, and thermal imaging to identify failure modes.
- Coordinate with external labs for SEM/EDS, FTIR, and FIB analyses.
- Write concise FA reports with findings and images to support design reviews.
- Translate evidence into root-cause conclusions and corrective actions.
๐ฏ Requirements
- Bachelorโs degree in Electrical Engineering, Materials Science, EET, Mechanical Eng, or related field.
- 5+ years hands-on FA experience on electronic hardware (PCBAs, motors, interconnects).
- Prototype or NPI background with rapid iteration cycles.
- Proficiency with FA tools: microscopes, multimeters, oscilloscopes, curve tracers.
- Thermal imaging/characterization; X-ray/CT and cross-sectioning.
- Read PCB schematics/layouts; coordinate with labs; strong writing; mentoring.
๐ Benefits
- Equity package via stock options.
- Robust healthcare, disability and life insurance.
- 401(k) retirement planning and flexible PTO.
- Free on-site catered meals.
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