Related skills
sem spc xrf electroplating four-point_probeπ Description
- Operate and maintain electrochemical plating equipment for uniform deposition
- Monitor and optimize plating parameters to ensure void-free fills
- Perform chemistry control, filtration, and waste treatment for purity
- Conduct post-plating metrology with XRF, four-point probe, and SEM
- Troubleshoot plating anomalies and adjust processes to improve yield
- Collaborate cross-functionally on root cause analysis and yield improvement
π― Requirements
- High school diploma or equivalency
- 3+ years in hands-on manufacturing; OR bachelor's in engineering/math/science
- Bachelor's in chemical eng, materials science, electrochemistry, or related field
- 3+ years electrochemical plating in semiconductor fab
- Proficiency in plating metals (Cu, Ni, Au, Ti, Rh, Pd, Co)
- Experience with process control and data analysis tools (Excel, SPC)
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