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die_bonders wire_bonders plasma_cleaners pull_shear_testers aoi_systemsπ Description
- Operate, maintain, and calibrate microelectronics equipment in an ESD cleanroom with precision.
- Manufacture high-mix, medium-volume HF RF products using diverse tools and stacking.
- Set up and calibrate die attach machines and automated ball bonders.
- Verify processes with metrology tools to assess epoxy voids and wirebond performance.
- Work independently in a fast-paced startup, managing workflow, safety, and 5S.
- Communicate via MS Office and ERP to coordinate with engineers.
π― Requirements
- High school diploma or equivalency.
- 2+ years in a cleanroom electronics manufacturing environment.
- Knowledge of microelectronics quality standards, incl die shear, wire pull, bond shear per MIL-STD-883 or JESD22-B116.
- Hands-on with die bonders, wire bonders, plasma cleaners, pull/shear testers, AOI, optical microscopes, laser markers.
- Exceptional attention to detail and high efficiency.
- Strong written and verbal communication skills.
π Benefits
- Comprehensive medical, vision, and dental coverage.
- 401(k) retirement plan.
- Short and long-term disability and life insurance.
- Paid parental leave and paid vacation.
- Stock options and employee stock purchase plan.
- Company shuttles to the Redmond office.
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