Related skills
doe smt die_bonding silicon_packaging📋 Description
- Execute new configuration introductions into production on tight timelines
- Program and operate microelectronics assembly machines (die/wire bonding)
- Train technicians to run and troubleshoot complex machines
- Design and implement assembly fixtures to improve processes
- DOE for iterative process improvement
- Collaborate with manufacturing, test, and design on design for manufacturing
🎯 Requirements
- High school diploma or equivalency
- 2+ years in hands-on manufacturing OR bachelor’s in engineering, math, or science
- Experience with microelectronics: die/wire bonding, SMT, or packaging
- Knowledge of MIL-STD-883 test methods
- Ability to read schematics and engineering drawings
- Excellent written and verbal communication
🎁 Benefits
- Medical, vision, and dental coverage
- 401(k) retirement plan
- Paid vacation and holidays; parental leave
- Shuttle service from Seattle to Redmond
- Stock options and Employee Stock Purchase Plan
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