Head of Chip Architecture

Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting thousands to millions of processors at the speed of light in extreme-scale data centers for the most advanced AI and HPC workloads.

Lightmatter raised $400 million in its Series D round, reaching a valuation of $4.4 billion. We will continue to accelerate the development of data center photonics and grow every department at Lightmatter!

If you're passionate about tackling complex challenges, making an impact, and being an expert in your craft, join our team of brilliant scientists, engineers, and accomplished industry leaders.

Lightmatter is (re)inventing the future of computing with light!

We are hiring a Head of Chip Architecture, you will collaborate with both external partners and internal engineering teams to develop and deliver innovative, high-volume photonics products. In this role, you will define advanced chip architectures for co-packaged optics, working closely with cross-disciplinary teams to model, analyze, and optimize system performance. Success in this role requires deep domain expertise in silicon photonics, high-frequency (50+ GHz) electro-optic interfaces, lasers, optical amplifiers, fiber-optic communications, and packaging/assembly techniques. Strong analytical problem-solving, effective communication, and technical leadership are essential. You will be expected to be the primary technical liaison for key customers, partners, and internal stakeholders. You will also represent Lightmatter’s at premier industry conferences.

Join a tight-knit team where each individual’s contributions directly influence the success of the company and product. You'll have the opportunity to build a new kind of computer from the ground up and to solve groundbreaking challenges along the way. Work with people who love to build and who thrive in technically diverse environments where great ideas are prioritized.

Responsibilities:

• Guide, coach, and mentor a team of chip architects from different domains: photonics, digital, and analog.
• Define chip architectures for datacenter/AI compute optical interconnect demonstrations and products.
• Lead the co-optimization of SerDes, analog front ends, and optical transceivers to achieve best-in-class performance in terms of performance, energy efficiency, and costs.
• Work with other engineering leaders to plan, set, and execute on development, tapeout, and validation timelines.
• Provide technical leadership to cross-functional engineering teams.
• Represent the architecture team in executive-level reviews, industry forums, and customer negotiations.
• Act as the primary technical liaison for key customers, partners, and stakeholders regarding our current chip’s architecture and future roadmap.
• Drive the technical selling process by clearly articulating the competitive advantages, performance metrics, and cost benefits to both technical and non-technical customers.
• Communicate complex technical concepts clearly to both technical and non-technical stakeholders.
• Partner with the Product and Sales teams to define next-generation photonic products.
• Research and evaluate emerging optical interconnect technologies, and drive technology roadmaps aligned with market trends and strategic objectives.
• Develop new IP. Publish technical findings at top journals and share our technical expertise at conferences.
• Be Lightmatter’s ambassador.

This is not a complete listing of the responsibilities. It’s a representation of the things you will be doing

Qualifications:

• A Ph.D. degree in Electrical Engineering, Applied Physics, or a related field with 10+ years of relevant experience and leading teams.
• Must have managerial experience
• Strong track record in managing teams and helping them grow and achieve at the highest level.
• Deep technical knowledge in photonic/AMS chip co-design.
• Proven success in developing, taping out, and bringing-up state-of-the-art photonic/AMS chips and system solutions.
• Proven track record of successfully taking at least two chip architectures from concept to high-volume production.
• Demonstrated experience serving as a primary technical point of contact with major external customers, partners, or vendors.
• Proven ability to translate complex technical concepts into compelling business value propositions for executive and non-technical audiences.
• Strong track record of planning and driving complex projects to completion.
• Ability to work cross-functionally with other organizations to achieve company-wide goals.
• Deep understanding of market trends and application of optical interconnects.
• Must to travel 30% of the time

Preferred Qualifications:

• World-class technical leadership: demonstrated absolute technical and people excellence.
• Strong track record of innovation in photonics as evidenced by patents and publications.
• Demonstrated creative problem-solving skills for problems that have no obvious solutions.
• Strong publication record and public speaking experience.
• Ability to retain and attract new talent.
• Executing R&D for product and market needs.
• Willingness to engage and learn quickly to ensure mission success. Self-starter with a “no task is too big or small” attitude.