Related skills
reliability photonics design for manufacturing osat 3d packaging📋 Description
- Develop end-to-end 3D package assembly, test, and fiber-attach processes with partners.
- Architect packages with DFT/DFM/DFR to meet performance and cost targets.
- Define test chip requirements and manage test chip design for 3D packaging.
- Develop and validate design rules for high-yield assembly, including backend/RDL.
- Plan and execute DOE and experiments, manage data, and analyze results.
- Identify reliability risks under use conditions and drive design/material solutions.
🎯 Requirements
- MS or PhD in Mechanical Eng, Materials Sci, or related field.
- 10+ years hands-on in package assembly/test with OSAT.
- 2D/3D packaging tech and thermo-mechanical challenges.
- Experience in test chip and assembly test vehicle design.
- Must be based in Taiwan; fluent in English & Mandarin.
- Strong communication, ownership, and problem-solving.
🎁 Benefits
- Comprehensive health plan (medical, dental, vision).
- Retirement savings matching.
- Life insurance (basic, voluntary & AD&D).
- Generous paid time off.
- Paid family leave.
- Equity grants for full-time employees.
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