Lead Package Assembly Integrator

📋 Description

• Develop end-to-end 3D package assembly, test, and fiber-attach processes with partners.
• Develop and execute package architectures meeting performance and reliability goals.
• Define test chip requirements and manage design for 3D package development.
• Develop and validate design rules for high-yield assembly processes.
• Plan and execute design of experiments, manage data, and analyze results.
• Analyze reliability risks under product use and drive improvements.

🎯 Requirements

• MS or PhD in Mechanical Engineering, Materials Science, or related field.
• 10-12 years of wafer-scale packaging assembly process development.
• Knowledge of 2D/3D packaging technologies, materials, and equipment.
• Proven ability to define test-chip and assembly-test requirements.
• Understanding of photonics packaging, including fiber attach methods.
• Experience with advanced packaging, including thermal, mechanical, reliability.

🎁 Benefits

• Comprehensive health care (medical, dental, vision).
• Retirement savings matching program.
• Life insurance (basic, voluntary, AD&D).
• Generous time off (vacation, sick days, holidays).
• Paid family leave.
• Short/long-term disability coverage.