Added
less than a minute ago
Location
Type
Full time
Salary
Upgrade to Premium to se...
Related skills
silicon photonics doe semiconductor packaging osat laser module packaging📋 Description
- Drive end-to-end laser module packaging design, analysis, and execution.
- Lead flip chip and wirebond assembly, plus substrate/PCB tech selection.
- Specify fiber attach methods and optical connector strategies for low-loss coupling.
- Identify reliability risks; plan/evaluate DOE to improve integrity and yields.
- Direct external partners and OSATs for seamless tech transfer and high-volume manufacturability.
- Partner with Silicon Photonics, Systems, Test & Reliability to optimize hardware.
🎯 Requirements
- MS or PhD in Mechanical, Materials, Electrical, or related field.
- 8+ years in semiconductor packaging or micro-electronics assembly.
- Experience with traditional and advanced packaging, materials science, and supply chain.
- Proficiency in flip chip and wirebond with design rules for HDI substrates.
- Hands-on experience with Silicon Photonics and III-V laser integration.
🎁 Benefits
- Comprehensive Health Care Plan (Medical, Dental & Vision)
- Retirement Savings Matching Program
- Life Insurance (Basic, Voluntary & AD&D)
- Generous Time Off (Vacation, Sick & Public Holidays)
- Paid Family Leave
- Equity grants (applicable to full-time employees)
Meet JobCopilot: Your Personal AI Job Hunter
Automatically Apply to Engineering Jobs. Just set your
preferences and Job Copilot will do the rest — finding, filtering, and applying while you focus on what matters.
Help us maintain the quality of jobs posted on Empllo!
Is this position not a remote job?
Let us know!