Related skills
sem x-ray ct scan non-destructive analysis destructive analysis📋 Description
- Interface with PCBA production, Supplier Development, Reliability, and EEE piece part groups.
- Perform destructive and non-destructive analyses during development and pre-production hardware.
- Analyze failures observed in production and assess manufacturing quality.
- Support investigations into non-conforming product and First Article Inspection Reports.
- Provide targeted surge support for critical analyses or qualification test efforts.
- Work directly in the Failure Analysis lab in a fast-paced environment.
🎯 Requirements
- Bachelor's degree in material science, electrical engineering, physics, or other STEM discipline.
- 1+ years of experience in semiconductor, package, and/or PCBA reliability.
- 1+ years of work experience failure analysis on semiconductor packages and devices.
- Experience with non-destructive analysis techniques such as Visual Inspection, X-Ray, CT, SEM, CSAM, and curve tracing.
- Experience with destructive analysis techniques such as Cross Section, parallel lapping and polishing, dye and pry, and chemical decapsulation.
- Understanding of basic electronic theory.
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