Related skills
sem eds fib cross-sectioning obirchπ Description
- Own end-to-end root-cause FA on microelectronics in manufacturing, test, and field.
- Conduct electrical fault isolation using curve trace, TDR, RF, LIT, OBIRCH, EBIRCH.
- Perform physical FA with SEM, FIB, EDS, cross-sectioning to identify failure mechanisms.
- Apply physics-of-failure to identify root causes (EM, fatigue, delamination, ESD).
- Drive corrective actions with design, packaging, and manufacturing teams to implement changes.
- Author detailed technical reports and ensure ITAR/compliance in FA activities.
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