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cleanroom dicing diamond_saws laser_dicing plasma_dicers📋 Description
- Operate and program dicing equipment (diamond saws, laser dicers)
- Perform full-cut/partial-cut or scribe-and-break on wafers and panels
- Develop and refine dicing recipes to optimize edges and yield
- Inspect edges with optical microscopes and testers
- Troubleshoot equipment issues and perform preventive maintenance
- Collaborate with process teams to integrate dicing into assembly flow
🎯 Requirements
- High school diploma or equivalent; 3+ years manufacturing OR eng/math/science degree
- 6+ years in silicon wafer or panel dicing (preferred)
- Proficiency with dicing tools: mechanical sawing and UV laser dicing
- Strong data skills: Excel and SPC for yield analysis
- Able to work in shift-based cleanroom; nights/weekends
- Safety, quality control, and lean manufacturing knowledge
- Experience with advanced dicing for chiplets/3D stacking (preferred)
🎁 Benefits
- Equal opportunity employer; committed to merit and diversity
- Work on Starlink in a fast-paced, high-precision environment
- Training and career growth opportunities
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