Added
7 days ago
Type
Internship
Salary
Salary not provided
Related skills
sem device physics tem microfabrication xpsπ Description
- Design and optimize semiconductor materials and device structures
- Collaborate with cleanroom engineers to fabricate devices and test structures
- Lead in-depth characterization of devices using TEM, SEM/FIB, and XPS
- Develop sample prep workflows (cross-sectioning, FIB lift-out) for quality characterization
- Analyze and communicate results to guide process and device improvements
π― Requirements
- Strong teamwork, communication, and proactive self-directed work style
- MSc or PhD (in progress or completed) in Materials Science, Physics, or EE
- Hands-on semiconductor microfabrication and materials/electrical characterization
- Semiconductor device physics: transport, interfaces, reliability
- Experience with device/material characterization and data analysis; modeling helpful
π Benefits
- Health insurance and other benefits
- Flexible spending accounts
- Retirement savings plan
- Life and disability insurance
- Paid and unpaid time off
- Employee discounts to VRAI
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