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3d 2.5d interposers bridges cpo packaging📋 Description
- Architect packaging solutions (2.5D/3D integration, interposers) for high-volume production.
- Develop packaging concepts for CPO packaging, including optical/electrical co-integration.
- Lead large-reticle/multi-die integration strategies with co-design and warpage control.
- Identify and solve fundamental packaging challenges in architecture and manufacturability for HPC chips.
- Collaborate with cross-functional teams to align packaging with requirements and milestones.
- Drive vendor engagement with foundries/OSATs for technology selection and qualification readiness.
🎯 Requirements
- Large-reticle and large-body integration with interposer/bridge architectures; manage mechanical/thermal risk at scale.
- Hands-on experience with CPO packaging and cross-domain trade-offs (electrical/optical/thermal/mechanical).
- Proven track record of developing productized, large-format, high-power, high-speed packaging for HPC.
- In-depth expertise across 2.5D/3D stacking, interposers/bridges, high-density substrates, and advanced materials.
- Strong chip-package co-design understanding (architecture, I/O, power, floorplanning).
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