Lead reliability test plans and assessments for HPC packages.
Optimize package design using thermo-mechanical modeling.
Develop and apply reliability models and lifetime-prediction methods.
Evaluate architectures, materials, and assembly processes to maximize reliability.
Predict electromigration lifetime of interconnects under load.

🎯 Requirements

8+ years in semiconductor package reliability and failure analysis.
Expert in 2.5D/3.5D packaging, interposers, HBMs, redistribution layers.
Led package failure investigations with root-cause analysis.
Strong thermal and mechanical finite-element modeling of packages.
Deep understanding of package materials: CTE, elasticity, creep.
MS or PhD in Mechanical Eng, Electrical Eng, Materials Science, Physics, or related.

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