Own packaging assembly from concept to mass production for wafer- and chip-level systems.
Develop new technologies and baselines for assembly and packaging.
NPI/NTI bring-up for assembly packaging lines.
Own packaging prototypes, product development, and release to production.
Select equipment and materials to meet quality, reliability, cost, and yield.
Interface with suppliers for improvement, cost reduction, and productivity.

🎯 Requirements

Bachelor's degree in engineering (electrical/mechanical/chemical/materials/physics)
1+ year with semiconductor packaging processing equipment or packaging design
Advanced technical degree
3+ years industry experience with microelectronics packaging development
Hands-on packaging, PCB/PCBA, or SMT assembly experience
OSAT (outsourced semiconductor assembly and test) experience

🎁 Benefits

Equal Opportunity Employer.

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