Related skills
ansys comsol fea multi-physics chiplets📋 Description
- Lead multi-physics modeling across thermal, mechanical, and electrical domains.
- Drive co-optimization of chip, package, and system interactions for power and thermal performance.
- Develop electro-thermal-mechanical simulations for 2.5D/3D packaging and HBM.
- Assess reliability: warpage, stress, underfill, solder fatigue, EM, thermo-mechanical failures.
- Correlate simulation results with silicon data and hardware measurements to improve accuracy.
🎯 Requirements
- Strong experience in thermal and mechanical modeling for advanced packaging systems.
- Solid understanding of electro-thermal interactions and temperature-dependent electrical behavior.
- Experience solving chip/package/system integration challenges with multi-physics simulations.
- Hands-on experience with FEA and tools such as ANSYS, COMSOL, Abaqus, Icepak.
- Knowledge of package reliability: warpage, solder fatigue, EM, thermo-mechanical.
- MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or related field.
- Strong communication and technical leadership.
🎁 Benefits
- Equity in compensation.
- Hybrid work environment.
- OpenAI equal opportunity policy.
- Reasonable accommodations on request.
- Opportunity to work on AI/HPC hardware.
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